Die Attach - Flip Chip Technology at die-attach.net

Die Attach - Flip Chip Technology at die-attach.net: Datacon is concentrating on advanced die attach solutions.

Datacon as a leading equipment supplier in the die attach advanced packaging technology is offering you the ideal solution for your die attach applications as well as for your Flip Chip applications. Adhesive processes (ICA / ACA / NCA): Also for most joining techniques with adhesives, working temperatures of up to 250 iC and also increased pressure are necessary. With Flip Chip applications all three of the adhesive types mentioned above in brackets are increasingly being used. Our vision is to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Advanced Packaging Die Attach Market. Datacon plays an important role in the technical and social success of microelectronics.