Flip Chip Bonder Directory - Datacon Technology AG is an internationally operating group of companies which developes and produces high-precision machines for the semiconductor industry and thus supplies leading microelectronics companies worldwide. 450 staff are currently employed under the umbrella of Datacon Technology AG, 110 of whom work in Research and Development. Datacon Semiconductor Equipment GmbH, Radfeld / Austria (development and production of die bonders), Eurotec GmbH, Berlin / Germany (special-purpose machine construction), and Datacon Hungary Kft, Gy? Hungary (component manufacture, assembly) are responsible for the business operations.